Seri SHV Rezistans
Derating
Derating (tèmik reziste.) LXP100 /LXP100 L: 0.66 W/K (1.5 K/W)
San yon koule chalè, lè nan lè louvri nan 25 ° C, LXP100 / LXP100 L a rated pou 3 W. Derating pou tanperati ki pi wo a 25 ° C se 0.023 W / K.
Tanperati ka dwe itilize pou definisyon limit pouvwa aplike a.Mezi tanperati ka a dwe fèt ak yon tèrmokapteur ki kontakte sant eleman ki monte sou koule chalè ki fèt la.Grès tèmik yo ta dwe aplike byen.
Valè sa a aplikab sèlman lè w ap itilize kondiksyon tèmik nan koule chalè Rth-cs
Dimansyon an milimèt
Espesifikasyon teknik ak estanda elektrik
Kalite | Puissance 25°C | Puissance 75°C | Puissance 125°C | Max.kV | Max.kV "S" | Dimansyon an milimèt (pous) | ||
A(±1.00/±0.04) | B (±1.00 /±0.04) | C (±1.00 /±0.04) | ||||||
SHV03 | 2.5 | 2.5 | 1.5 | 3.0 | 4.8 | 20.2.00/0.80 | 8.20/0.32 | 1.00/0.04 |
SHV04 | 3.7 | 3.7 | 2.5 | 4.0 | 6.4 | 26.9/1.06 | 8.20/0.32 | 1.00/0.04 |
SHV05 | 4.5 | 4.5 | 3.0 | 5.0 | 8.0 | 33.0/1.30 | 8.20/0.32 | 1.00/0.04 |
SHV06 | 5.2 | 5.2 | 3.5 | 8.0 | 12.8 | 39.5/1.56 | 8.20/0.32 | 1.00/0.04 |
SHV08 | 7.5 | 7.5 | 5.0 | 10.0 | 16.0 | 52.1/2.05 | 8.20/0.32 | 1.00/0.04 |
SHV11 | 11 | 11 | 7.5 | 15.0 | 24.0 | 77.70/3.06 | 8.20/0.32 | 1.00/0.04 |
SHV12 | 12 | 12 | 8.0 | 20.0 | 32.0 | 102.9/4.05 | 8.20/0.32 | 1.00/0.04 |
SHV15 | 15 | 15 | 10.0 | 25.0 | 40.0 | 1233.7/4.87 | 8.20/0.32 | 1.00/0.04 |
SHV20 | 20 | 20 | 15.0 | 30.0 | 48.0 | 153.7/6.05 | 8.20/0.32 | 1.00/0.04 |
Espesifikasyon
Ranje rezistans | 100Ω -1GΩ |
Tolerans rezistans | ± 0.5% a ± 10% estanda desann nan ±0.1% sou demann espesyal pou valè ohmik limite |
Koefisyan Tanperati | ±80 ppm/°C (nan +85°C ref. pou +25°C) desann nan ± 25 ppm / °C oswa pi ba sou demann espesyal pou valè ohmik limite ak modèl non. |
Max.Tanperati Fonksyònman | + 225 °C |
Chaje lavi | 1,000 èdtan nan 125 ° C ak pouvwa nominale, konpozan ak 1% tol.ΔR 0.2% max., ΔR = 0.5% max. |
Chaje estabilite lavi | tipik ±0.02% pou chak 1,000 èdtan |
Rezistans imidite | MIL-Std-202, metòd 106, ΔR 0.4% max. |
Chòk tèmik | MIL-Std-202, metòd 107, Kond.C, ΔR 0.25% max. |
Enkapsulasyon: estanda | silicone coatin lòt opsyon kouch (tankou 2xpolyimide, vè) ki disponib sou demann |
Materyèl plon | OFHC fèblan plake |
Pwa | depann sou modèl non.(mande pou detay) Sou demann espesyal pou diferan vòltaj ak gwosè |
Enfòmasyon sou lòd
Kalite | ohmik | TCR | TOL |
SHV04 | 20M | 25PPM | 1% |