Seri SHV Rezistans
Derating
Derating (tèmik reziste.) LXP100 /LXP100 L: 0.66 W/K (1.5 K/W)
San yon koule chalè, lè nan lè louvri nan 25 ° C, LXP100 / LXP100 L a rated pou 3 W. Derating pou tanperati ki pi wo a 25 ° C se 0.023 W / K.
Tanperati ka dwe itilize pou definisyon limit pouvwa aplike a.Mezi tanperati ka dwe fèt ak yon tèrmokapteur ki kontakte sant eleman ki monte sou koule chalè ki fèt la.Grès tèmik yo ta dwe aplike byen.
Valè sa a aplikab sèlman lè w ap itilize kondiksyon tèmik nan koule chalè Rth-cs
Dimansyon an milimèt
Espesifikasyon teknik ak estanda elektrik
Kalite | Puissance 25°C | Puissance 75°C | Puissance 125°C | Max.kV | Max.kV "S" | Dimansyon an milimèt (pous) | ||
A(±1.00/±0.04) | B (±1.00 /±0.04) | C (±1.00 /±0.04) | ||||||
SHV03 | 2.5 | 2.5 | 1.5 | 3.0 | 4.8 | 20.2.00/0.80 | 8.20/0.32 | 1.00/0.04 |
SHV04 | 3.7 | 3.7 | 2.5 | 4.0 | 6.4 | 26.9/1.06 | 8.20/0.32 | 1.00/0.04 |
SHV05 | 4.5 | 4.5 | 3.0 | 5.0 | 8.0 | 33.0/1.30 | 8.20/0.32 | 1.00/0.04 |
SHV06 | 5.2 | 5.2 | 3.5 | 8.0 | 12.8 | 39.5/1.56 | 8.20/0.32 | 1.00/0.04 |
SHV08 | 7.5 | 7.5 | 5.0 | 10.0 | 16.0 | 52.1/2.05 | 8.20/0.32 | 1.00/0.04 |
SHV11 | 11 | 11 | 7.5 | 15.0 | 24.0 | 77.70/3.06 | 8.20/0.32 | 1.00/0.04 |
SHV12 | 12 | 12 | 8.0 | 20.0 | 32.0 | 102.9/4.05 | 8.20/0.32 | 1.00/0.04 |
SHV15 | 15 | 15 | 10.0 | 25.0 | 40.0 | 1233.7/4.87 | 8.20/0.32 | 1.00/0.04 |
SHV20 | 20 | 20 | 15.0 | 30.0 | 48.0 | 153.7/6.05 | 8.20/0.32 | 1.00/0.04 |
Espesifikasyon
Ranje rezistans | 100Ω -1GΩ |
Tolerans rezistans | ± 0.5% a ± 10% estanda desann nan ± 0.1% sou demann espesyal pou valè ohmik limite |
Koefisyan Tanperati | ±80 ppm/°C (nan +85°C ref. pou +25°C) desann nan ± 25 ppm / °C oswa pi ba sou demann espesyal pou valè ohmik limite ak modèl non. |
Max.Tanperati Fonksyònman | + 225 °C |
Chaje lavi | 1,000 èdtan nan 125 ° C ak pouvwa nominale, konpozan ak 1% tol.ΔR 0.2% max., ΔR = 0.5% max. |
Chaje estabilite lavi | tipik ±0.02% pou chak 1,000 èdtan |
Rezistans imidite | MIL-Std-202, metòd 106, ΔR 0.4% max. |
Chòk tèmik | MIL-Std-202, metòd 107, Kond.C, ΔR 0.25% max. |
Enkapsulasyon: estanda | silicone coatin lòt opsyon kouch (tankou 2xpolyimide, vè) ki disponib sou demann |
Materyèl plon | OFHC fèblan plake |
Pwa | depann sou modèl non.(mande pou detay) Sou demann espesyal pou diferan vòltaj ak gwosè |
Enfòmasyon sou lòd
Kalite | ohmik | TCR | TOL |
SHV04 | 20M | 25PPM | 1% |